Development of a new material for microelectronics encapsulation
This project seek to develop and characterise a new rubber-toughened moulding compound for microelectronics encapsulation purposes. The system evaluated was a poly(isocyanurate-oxazolidone) (ISOX) material with an elastomeric castor oil based polyurethane (PU) as the modifier phase. The reaction sys...
Main Author: | |
---|---|
Other Authors: | |
Format: | Thesis |
Language: | English |
Published: |
2009
|
Subjects: | |
Online Access: | http://hdl.handle.net/10356/20446 |