Development of a new material for microelectronics encapsulation

This project seek to develop and characterise a new rubber-toughened moulding compound for microelectronics encapsulation purposes. The system evaluated was a poly(isocyanurate-oxazolidone) (ISOX) material with an elastomeric castor oil based polyurethane (PU) as the modifier phase. The reaction sys...

Full description

Bibliographic Details
Main Author: Koh, Loo Yee.
Other Authors: Chian, Kerm Sin
Format: Thesis
Language:English
Published: 2009
Subjects:
Online Access:http://hdl.handle.net/10356/20446