Development of a new material for microelectronics encapsulation
This project seek to develop and characterise a new rubber-toughened moulding compound for microelectronics encapsulation purposes. The system evaluated was a poly(isocyanurate-oxazolidone) (ISOX) material with an elastomeric castor oil based polyurethane (PU) as the modifier phase. The reaction sys...
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| Other Authors: | |
| Format: | Thesis |
| Language: | English |
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2009
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| Online Access: | http://hdl.handle.net/10356/20446 |
| _version_ | 1811684209596563456 |
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| author | Koh, Loo Yee. |
| author2 | Chian, Kerm Sin |
| author_facet | Chian, Kerm Sin Koh, Loo Yee. |
| author_sort | Koh, Loo Yee. |
| collection | NTU |
| description | This project seek to develop and characterise a new rubber-toughened moulding compound for microelectronics encapsulation purposes. The system evaluated was a poly(isocyanurate-oxazolidone) (ISOX) material with an elastomeric castor oil based polyurethane (PU) as the modifier phase. The reaction system consisted of a polyfunctional 4,4-diphenylmethane diisocyanate (PolyMDI), diglycidyl ether of bisphenol A (DGEBA), castor oil and an amine catalyst Ancamine K54. The ISOX matrix phase was formed by reacting DGEBA with PolyMDI and the rubbery PU phase from castor oil and PolyMDI. This PU phase was incorporated into the ISOX matrix through covalently bonding the two materials via various chemical reactions. The objectives of the project include studying the cure behaviour of the ISOX and PU systems and to optimise their cure conditions. The effects of varying concentration of the toughening phases on the physical, mechanical and thermal properties of the system were characterised. |
| first_indexed | 2024-10-01T04:25:00Z |
| format | Thesis |
| id | ntu-10356/20446 |
| institution | Nanyang Technological University |
| language | English |
| last_indexed | 2024-10-01T04:25:00Z |
| publishDate | 2009 |
| record_format | dspace |
| spelling | ntu-10356/204462020-09-27T20:15:38Z Development of a new material for microelectronics encapsulation Koh, Loo Yee. Chian, Kerm Sin School of Applied Science DRNTU::Engineering::Materials::Microelectronics and semiconductor materials This project seek to develop and characterise a new rubber-toughened moulding compound for microelectronics encapsulation purposes. The system evaluated was a poly(isocyanurate-oxazolidone) (ISOX) material with an elastomeric castor oil based polyurethane (PU) as the modifier phase. The reaction system consisted of a polyfunctional 4,4-diphenylmethane diisocyanate (PolyMDI), diglycidyl ether of bisphenol A (DGEBA), castor oil and an amine catalyst Ancamine K54. The ISOX matrix phase was formed by reacting DGEBA with PolyMDI and the rubbery PU phase from castor oil and PolyMDI. This PU phase was incorporated into the ISOX matrix through covalently bonding the two materials via various chemical reactions. The objectives of the project include studying the cure behaviour of the ISOX and PU systems and to optimise their cure conditions. The effects of varying concentration of the toughening phases on the physical, mechanical and thermal properties of the system were characterised. Master of Applied Science 2009-12-15T03:00:09Z 2009-12-15T03:00:09Z 1997 1997 Thesis http://hdl.handle.net/10356/20446 en NANYANG TECHNOLOGICAL UNIVERSITY 163 p. application/pdf |
| spellingShingle | DRNTU::Engineering::Materials::Microelectronics and semiconductor materials Koh, Loo Yee. Development of a new material for microelectronics encapsulation |
| title | Development of a new material for microelectronics encapsulation |
| title_full | Development of a new material for microelectronics encapsulation |
| title_fullStr | Development of a new material for microelectronics encapsulation |
| title_full_unstemmed | Development of a new material for microelectronics encapsulation |
| title_short | Development of a new material for microelectronics encapsulation |
| title_sort | development of a new material for microelectronics encapsulation |
| topic | DRNTU::Engineering::Materials::Microelectronics and semiconductor materials |
| url | http://hdl.handle.net/10356/20446 |
| work_keys_str_mv | AT kohlooyee developmentofanewmaterialformicroelectronicsencapsulation |