Development of a chip-on-tape encapsulation process
This thesis summarizes the work conducted in an effort to develop an encapsulation process for a chip-on-tape package. The various studies conducted included encapsulation material selection, encapsulation process studies and optimization and FEA simulations for the prediction of package performance...
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| Format: | Thesis |
| Language: | English |
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2009
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| Online Access: | http://hdl.handle.net/10356/20541 |