Development of a chip-on-tape encapsulation process
This thesis summarizes the work conducted in an effort to develop an encapsulation process for a chip-on-tape package. The various studies conducted included encapsulation material selection, encapsulation process studies and optimization and FEA simulations for the prediction of package performance...
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| Format: | Thesis |
| Language: | English |
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2009
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| Online Access: | http://hdl.handle.net/10356/20541 |
| _version_ | 1824455553204617216 |
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| author | Mui, Yew Cheong. |
| author2 | Tan, Soo Lip |
| author_facet | Tan, Soo Lip Mui, Yew Cheong. |
| author_sort | Mui, Yew Cheong. |
| collection | NTU |
| description | This thesis summarizes the work conducted in an effort to develop an encapsulation process for a chip-on-tape package. The various studies conducted included encapsulation material selection, encapsulation process studies and optimization and FEA simulations for the prediction of package performance. Reliability tests which included temperature cycle test and high temperature- high humidity test were also conducted in the material selection phase. |
| first_indexed | 2025-02-19T03:40:02Z |
| format | Thesis |
| id | ntu-10356/20541 |
| institution | Nanyang Technological University |
| language | English |
| last_indexed | 2025-02-19T03:40:02Z |
| publishDate | 2009 |
| record_format | dspace |
| spelling | ntu-10356/205412020-09-26T22:14:39Z Development of a chip-on-tape encapsulation process Mui, Yew Cheong. Tan, Soo Lip Gintic Institute of Manufacturing Technology DRNTU::Engineering::Manufacturing::Product engineering This thesis summarizes the work conducted in an effort to develop an encapsulation process for a chip-on-tape package. The various studies conducted included encapsulation material selection, encapsulation process studies and optimization and FEA simulations for the prediction of package performance. Reliability tests which included temperature cycle test and high temperature- high humidity test were also conducted in the material selection phase. Master of Science (Precision Engineering) 2009-12-15T03:17:38Z 2009-12-15T03:17:38Z 1996 1996 Thesis http://hdl.handle.net/10356/20541 en NANYANG TECHNOLOGICAL UNIVERSITY 79 p. application/pdf |
| spellingShingle | DRNTU::Engineering::Manufacturing::Product engineering Mui, Yew Cheong. Development of a chip-on-tape encapsulation process |
| title | Development of a chip-on-tape encapsulation process |
| title_full | Development of a chip-on-tape encapsulation process |
| title_fullStr | Development of a chip-on-tape encapsulation process |
| title_full_unstemmed | Development of a chip-on-tape encapsulation process |
| title_short | Development of a chip-on-tape encapsulation process |
| title_sort | development of a chip on tape encapsulation process |
| topic | DRNTU::Engineering::Manufacturing::Product engineering |
| url | http://hdl.handle.net/10356/20541 |
| work_keys_str_mv | AT muiyewcheong developmentofachipontapeencapsulationprocess |