Contact-displacement PD deposition for electroless copper application
Electroless (EL) Cu, a potential seed layer material for Cu interconnects used in nanoelectronics, is intimately dependent on the surface activation of catalytic Pd particles. A comprehensive understanding on the deposition mechanism of Pd particles is thus critically important. In this thesis, the...
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| Format: | Thesis |
| Language: | English |
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2009
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| Online Access: | https://hdl.handle.net/10356/20632 |