Theoretical formulations and computational modeling of flexible circuit's behaviour
In this report, an in-depth study on the behaviour of the Hewlett-Packard flexible circuit when cooled from the elevated curing temperature to room temperature is presented. The purpose of this study is to develop a mathematical model using the Classical Laminate Theory in conjunction with the mini...
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| Format: | Thesis |
| Language: | English |
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2009
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| Online Access: | http://hdl.handle.net/10356/20667 |