Device design, characterization and modeling of inductors and interconnects for RFIC applications
Escalating demands for personal wireless communication equipment have spearheaded development of affordable RF System-on-Chip (SoC) solutions. Silicon is believed to be the most suitable material that can satisfy the demands of this rapidly growing wireless market. Advancements in technology have co...
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| Format: | Thesis |
| Language: | English |
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2009
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| Online Access: | https://hdl.handle.net/10356/20669 |