Development of copper metallization for Deep Submicron Integrated Circuits (DSICs)

Development of copper metallization for Deep Submicron Integrated Circuits (DSICs)

The development of copper metallization for deep submicron integrated circuits (DSICs) was a project jointly funded by the Ministry of Education (MoE) and the Agency for Science Technology and Research (A*STAR). Being a very broad based project, the report is deliberately divided into 3 parts. Each...

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Bibliographic Details
Main Authors: Krishnamachar Prasad, Zhang, Dao Hua, Tan, Cher Ming
Other Authors: School of Electrical and Electronic Engineering
Format: Research Report
Published: 2008
Subjects:
DRNTU::Engineering::Electrical and electronic engineering::Integrated circuits
Online Access:http://hdl.handle.net/10356/2896

Internet

http://hdl.handle.net/10356/2896

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