Development of copper metallization for Deep Submicron Integrated Circuits (DSICs)

Development of copper metallization for Deep Submicron Integrated Circuits (DSICs)

The development of copper metallization for deep submicron integrated circuits (DSICs) was a project jointly funded by the Ministry of Education (MoE) and the Agency for Science Technology and Research (A*STAR). Being a very broad based project, the report is deliberately divided into 3 parts. Each...

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Bibliografische gegevens
Hoofdauteurs: Krishnamachar Prasad, Zhang, Dao Hua, Tan, Cher Ming
Andere auteurs: School of Electrical and Electronic Engineering
Formaat: Research Report
Gepubliceerd in: 2008
Onderwerpen:
DRNTU::Engineering::Electrical and electronic engineering::Integrated circuits
Online toegang:http://hdl.handle.net/10356/2896

Internet

http://hdl.handle.net/10356/2896

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