Fabrication and characterization of thin film novel materials for microdevices and microsystems
Aluminium and aluminium alloys have been widely used as the interconnection materials to link transistors. Its application in ultra-large scale integration (ULSI) circuits is endorsed because the physical and chemical properties of aluminium are compatible with ULSI processing: Aluminium forms a thi...
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| Format: | Research Report |
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2008
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| Online Access: | http://hdl.handle.net/10356/2915 |