Review and analysis of device characterization structures and methodologies used for mixed signal integrated circuits
This project focues on the evaluation of the various characterization techniques and test structure designs for both active and passive component used in deep sub-micron high frequency mixed signal (analog/digital) integrated circuits. Key device parameters and matching of both passive components (r...
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Format: | Thesis |
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2008
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Online Access: | http://hdl.handle.net/10356/3148 |
_version_ | 1826127992578899968 |
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author | Purakh Raj Verma. |
author2 | Lau, Michael Wai Shing |
author_facet | Lau, Michael Wai Shing Purakh Raj Verma. |
author_sort | Purakh Raj Verma. |
collection | NTU |
description | This project focues on the evaluation of the various characterization techniques and test structure designs for both active and passive component used in deep sub-micron high frequency mixed signal (analog/digital) integrated circuits. Key device parameters and matching of both passive components (resistors & capacitor) and active components (mainly MOS transistors) are discussed in detail. |
first_indexed | 2024-10-01T07:17:33Z |
format | Thesis |
id | ntu-10356/3148 |
institution | Nanyang Technological University |
last_indexed | 2024-10-01T07:17:33Z |
publishDate | 2008 |
record_format | dspace |
spelling | ntu-10356/31482023-07-04T15:18:41Z Review and analysis of device characterization structures and methodologies used for mixed signal integrated circuits Purakh Raj Verma. Lau, Michael Wai Shing School of Electrical and Electronic Engineering DRNTU::Engineering::Electrical and electronic engineering::Integrated circuits This project focues on the evaluation of the various characterization techniques and test structure designs for both active and passive component used in deep sub-micron high frequency mixed signal (analog/digital) integrated circuits. Key device parameters and matching of both passive components (resistors & capacitor) and active components (mainly MOS transistors) are discussed in detail. Master of Science (Microelectronics) 2008-09-17T09:23:17Z 2008-09-17T09:23:17Z 2003 2003 Thesis http://hdl.handle.net/10356/3148 Nanyang Technological University application/pdf |
spellingShingle | DRNTU::Engineering::Electrical and electronic engineering::Integrated circuits Purakh Raj Verma. Review and analysis of device characterization structures and methodologies used for mixed signal integrated circuits |
title | Review and analysis of device characterization structures and methodologies used for mixed signal integrated circuits |
title_full | Review and analysis of device characterization structures and methodologies used for mixed signal integrated circuits |
title_fullStr | Review and analysis of device characterization structures and methodologies used for mixed signal integrated circuits |
title_full_unstemmed | Review and analysis of device characterization structures and methodologies used for mixed signal integrated circuits |
title_short | Review and analysis of device characterization structures and methodologies used for mixed signal integrated circuits |
title_sort | review and analysis of device characterization structures and methodologies used for mixed signal integrated circuits |
topic | DRNTU::Engineering::Electrical and electronic engineering::Integrated circuits |
url | http://hdl.handle.net/10356/3148 |
work_keys_str_mv | AT purakhrajverma reviewandanalysisofdevicecharacterizationstructuresandmethodologiesusedformixedsignalintegratedcircuits |