Review and analysis of device characterization structures and methodologies used for mixed signal integrated circuits

This project focues on the evaluation of the various characterization techniques and test structure designs for both active and passive component used in deep sub-micron high frequency mixed signal (analog/digital) integrated circuits. Key device parameters and matching of both passive components (r...

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Bibliographic Details
Main Author: Purakh Raj Verma.
Other Authors: Lau, Michael Wai Shing
Format: Thesis
Published: 2008
Subjects:
Online Access:http://hdl.handle.net/10356/3148
_version_ 1826127992578899968
author Purakh Raj Verma.
author2 Lau, Michael Wai Shing
author_facet Lau, Michael Wai Shing
Purakh Raj Verma.
author_sort Purakh Raj Verma.
collection NTU
description This project focues on the evaluation of the various characterization techniques and test structure designs for both active and passive component used in deep sub-micron high frequency mixed signal (analog/digital) integrated circuits. Key device parameters and matching of both passive components (resistors & capacitor) and active components (mainly MOS transistors) are discussed in detail.
first_indexed 2024-10-01T07:17:33Z
format Thesis
id ntu-10356/3148
institution Nanyang Technological University
last_indexed 2024-10-01T07:17:33Z
publishDate 2008
record_format dspace
spelling ntu-10356/31482023-07-04T15:18:41Z Review and analysis of device characterization structures and methodologies used for mixed signal integrated circuits Purakh Raj Verma. Lau, Michael Wai Shing School of Electrical and Electronic Engineering DRNTU::Engineering::Electrical and electronic engineering::Integrated circuits This project focues on the evaluation of the various characterization techniques and test structure designs for both active and passive component used in deep sub-micron high frequency mixed signal (analog/digital) integrated circuits. Key device parameters and matching of both passive components (resistors & capacitor) and active components (mainly MOS transistors) are discussed in detail. Master of Science (Microelectronics) 2008-09-17T09:23:17Z 2008-09-17T09:23:17Z 2003 2003 Thesis http://hdl.handle.net/10356/3148 Nanyang Technological University application/pdf
spellingShingle DRNTU::Engineering::Electrical and electronic engineering::Integrated circuits
Purakh Raj Verma.
Review and analysis of device characterization structures and methodologies used for mixed signal integrated circuits
title Review and analysis of device characterization structures and methodologies used for mixed signal integrated circuits
title_full Review and analysis of device characterization structures and methodologies used for mixed signal integrated circuits
title_fullStr Review and analysis of device characterization structures and methodologies used for mixed signal integrated circuits
title_full_unstemmed Review and analysis of device characterization structures and methodologies used for mixed signal integrated circuits
title_short Review and analysis of device characterization structures and methodologies used for mixed signal integrated circuits
title_sort review and analysis of device characterization structures and methodologies used for mixed signal integrated circuits
topic DRNTU::Engineering::Electrical and electronic engineering::Integrated circuits
url http://hdl.handle.net/10356/3148
work_keys_str_mv AT purakhrajverma reviewandanalysisofdevicecharacterizationstructuresandmethodologiesusedformixedsignalintegratedcircuits