A study of effect of ICPA on RF CBGA packages
Most radio frequency integrated circuit (RFIC) designers concentrate their characterization effort on the die. Often the package design is being overlooked. Due to the growing concerns in high frequency design, consideration of parasitic effects for the bonding wires is essential in integrated circu...
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| Format: | Thesis |
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2008
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| Online Access: | http://hdl.handle.net/10356/3157 |