Source line resistance failure issues and process optimisation of self aligned source etch
A self-aligned source oxide etch recipe using low power recipe was changed to higher power recipe to improve production cycle time (due to higher etch rate) and resolve plasma un-ignition. However, some lots started to fail with higher source line resistance during electrical testing.
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| Format: | Thesis |
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2008
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| Online Access: | http://hdl.handle.net/10356/3297 |