Source line resistance failure issues and process optimisation of self aligned source etch
A self-aligned source oxide etch recipe using low power recipe was changed to higher power recipe to improve production cycle time (due to higher etch rate) and resolve plasma un-ignition. However, some lots started to fail with higher source line resistance during electrical testing.
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Format: | Thesis |
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2008
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Online Access: | http://hdl.handle.net/10356/3297 |
_version_ | 1811682420541358080 |
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author | Su, Julia Hui Fong. |
author2 | Prasad, Krishnamachar |
author_facet | Prasad, Krishnamachar Su, Julia Hui Fong. |
author_sort | Su, Julia Hui Fong. |
collection | NTU |
description | A self-aligned source oxide etch recipe using low power recipe was changed to higher power recipe to improve production cycle time (due to higher etch rate) and resolve plasma un-ignition. However, some lots started to fail with higher source line resistance during electrical testing. |
first_indexed | 2024-10-01T03:56:33Z |
format | Thesis |
id | ntu-10356/3297 |
institution | Nanyang Technological University |
last_indexed | 2024-10-01T03:56:33Z |
publishDate | 2008 |
record_format | dspace |
spelling | ntu-10356/32972023-07-04T16:05:38Z Source line resistance failure issues and process optimisation of self aligned source etch Su, Julia Hui Fong. Prasad, Krishnamachar School of Electrical and Electronic Engineering DRNTU::Engineering::Electrical and electronic engineering::Microelectronics A self-aligned source oxide etch recipe using low power recipe was changed to higher power recipe to improve production cycle time (due to higher etch rate) and resolve plasma un-ignition. However, some lots started to fail with higher source line resistance during electrical testing. Master of Science (Microelectronics) 2008-09-17T09:26:47Z 2008-09-17T09:26:47Z 2004 2004 Thesis http://hdl.handle.net/10356/3297 Nanyang Technological University application/pdf |
spellingShingle | DRNTU::Engineering::Electrical and electronic engineering::Microelectronics Su, Julia Hui Fong. Source line resistance failure issues and process optimisation of self aligned source etch |
title | Source line resistance failure issues and process optimisation of self aligned source etch |
title_full | Source line resistance failure issues and process optimisation of self aligned source etch |
title_fullStr | Source line resistance failure issues and process optimisation of self aligned source etch |
title_full_unstemmed | Source line resistance failure issues and process optimisation of self aligned source etch |
title_short | Source line resistance failure issues and process optimisation of self aligned source etch |
title_sort | source line resistance failure issues and process optimisation of self aligned source etch |
topic | DRNTU::Engineering::Electrical and electronic engineering::Microelectronics |
url | http://hdl.handle.net/10356/3297 |
work_keys_str_mv | AT sujuliahuifong sourcelineresistancefailureissuesandprocessoptimisationofselfalignedsourceetch |