High-k hafnium oxide based thin films using laser molecular beam epitaxy for gate dielectrics

The constant increase in integrated circuit densities predicted by Moore’s law requires the continuous reduction of the CMOS device dimensions such as the gate length, gate oxide thickness, etc. Silicon dioxide (SiO2) has been used as the gate oxide and been aggressively scaled for more than 30 year...

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Bibliographic Details
Main Author: Lu, Yuekang
Other Authors: Zhu Weiguang
Format: Thesis
Published: 2008
Subjects:
Online Access:https://hdl.handle.net/10356/3502
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author Lu, Yuekang
author2 Zhu Weiguang
author_facet Zhu Weiguang
Lu, Yuekang
author_sort Lu, Yuekang
collection NTU
description The constant increase in integrated circuit densities predicted by Moore’s law requires the continuous reduction of the CMOS device dimensions such as the gate length, gate oxide thickness, etc. Silicon dioxide (SiO2) has been used as the gate oxide and been aggressively scaled for more than 30 years. Nowadays in the state-of-the-art MOSFET, the gate oxide thickness is reduced to 1.2 nm. However, with the use of such thin SiO2,direct tunneling dominates the dielectric conduction which results in high leakage current and unacceptable power dissipations. In order to maintain the performance improvement trends, there are growing interests in the replacement of SiO2 with a high-k dielectric material.
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spelling ntu-10356/35022023-07-04T17:34:04Z High-k hafnium oxide based thin films using laser molecular beam epitaxy for gate dielectrics Lu, Yuekang Zhu Weiguang School of Electrical and Electronic Engineering DRNTU::Engineering::Electrical and electronic engineering::Integrated circuits The constant increase in integrated circuit densities predicted by Moore’s law requires the continuous reduction of the CMOS device dimensions such as the gate length, gate oxide thickness, etc. Silicon dioxide (SiO2) has been used as the gate oxide and been aggressively scaled for more than 30 years. Nowadays in the state-of-the-art MOSFET, the gate oxide thickness is reduced to 1.2 nm. However, with the use of such thin SiO2,direct tunneling dominates the dielectric conduction which results in high leakage current and unacceptable power dissipations. In order to maintain the performance improvement trends, there are growing interests in the replacement of SiO2 with a high-k dielectric material. DOCTOR OF PHILOSOPHY (EEE) 2008-09-17T09:31:07Z 2008-09-17T09:31:07Z 2006 2006 Thesis Lu, Y. (2006). High-k hafnium oxide based thin films using laser molecular beam epitaxy for gate dielectrics. Doctoral thesis, Nanyang Technological University, Singapore. https://hdl.handle.net/10356/3502 10.32657/10356/3502 Nanyang Technological University application/pdf
spellingShingle DRNTU::Engineering::Electrical and electronic engineering::Integrated circuits
Lu, Yuekang
High-k hafnium oxide based thin films using laser molecular beam epitaxy for gate dielectrics
title High-k hafnium oxide based thin films using laser molecular beam epitaxy for gate dielectrics
title_full High-k hafnium oxide based thin films using laser molecular beam epitaxy for gate dielectrics
title_fullStr High-k hafnium oxide based thin films using laser molecular beam epitaxy for gate dielectrics
title_full_unstemmed High-k hafnium oxide based thin films using laser molecular beam epitaxy for gate dielectrics
title_short High-k hafnium oxide based thin films using laser molecular beam epitaxy for gate dielectrics
title_sort high k hafnium oxide based thin films using laser molecular beam epitaxy for gate dielectrics
topic DRNTU::Engineering::Electrical and electronic engineering::Integrated circuits
url https://hdl.handle.net/10356/3502
work_keys_str_mv AT luyuekang highkhafniumoxidebasedthinfilmsusinglasermolecularbeamepitaxyforgatedielectrics