Soldering alloys : composition, microstructure and joint characteristics

Microstructure and mechanical properties of two new solder materials were investigated. Its elemental composition before and after cooling was also studied. New solder material was proposed to be able to join ceramics such as aluminium or titanium oxide without much intensive sample preparation. T...

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Bibliographic Details
Main Author: Ang, Edwin Hui Jun
Other Authors: Chen Zhong
Format: Final Year Project (FYP)
Language:English
Published: 2010
Subjects:
Online Access:http://hdl.handle.net/10356/35666