| Summary: | Microstructure and mechanical properties of two new solder materials were investigated. Its elemental composition before and after cooling was also studied. New solder material was proposed to be able to join ceramics such as aluminium or titanium oxide without much intensive sample preparation. Tests were conducted to find tensile strength, hardness, elemental percentage of the solder after Aluminum, Titanium and Stainless Steel substrate metals were being soldered. Results revealed that Al which was added in both solders, increased the oxidation resistance and was the primarily reason for the increase in wettability. Dispersion strengthening occurred as a result of second phase formed by Al in the IMC and AgZn3 in the bulk increased the strength of the solder. More work could be done on using different metal substrate and thermal aging of the samples.
|
|---|