New techniques for localization of shorted and open interconnect failures in ICs by using laser beam technology
Open-circuit and short-circuit defects in electrical conductors within integrated circuits (ICs) can result in major IC yield and reliability problems. A capability for localizing and identifying these types of defects is important for analyzing ICs to determine failure mechanisms therein, for quali...
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| Format: | Thesis |
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2008
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| Online Access: | http://hdl.handle.net/10356/3576 |