Investigation of interfacial reactions and its effects on the thermal properties of cordierite-AlN composites for microelectronic packaging applications
Advances in microelectronic devices have been made possible by the constant miniaturization of devices through advanced materials and processes. This ongoing strive for better performance has led to the desire to improve the reliability of microelectronic packages. The development and design optimis...
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| 格式: | Final Year Project (FYP) |
| 语言: | English |
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2010
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| 在线阅读: | http://hdl.handle.net/10356/35765 |