Investigation of interfacial reactions and its effects on the thermal properties of cordierite-AlN composites for microelectronic packaging applications

Advances in microelectronic devices have been made possible by the constant miniaturization of devices through advanced materials and processes. This ongoing strive for better performance has led to the desire to improve the reliability of microelectronic packages. The development and design optimis...

全面介绍

书目详细资料
主要作者: Ong, Soon Hoe.
其他作者: Oh Joo Tien
格式: Final Year Project (FYP)
语言:English
出版: 2010
主题:
在线阅读:http://hdl.handle.net/10356/35765