Study of microstructures and mechanical properties of lead-free solder joints

220 p.

Bibliographic Details
Main Author:	Ngoh, Shwu Lan
Other Authors:	Pang Hock Lye, John
Format:	Thesis
Published:	2010
Subjects:	DRNTU::Engineering::Mechanical engineering::Mechanics and dynamics
Online Access:	https://hdl.handle.net/10356/36000

Internet

https://hdl.handle.net/10356/36000