Improvement on within wafer and wafer-to-wafer uniformity by chemical mechanical polishing (CMP)
CMP plays a very important role to realize multi-level metallization which is dependent on the ability to effectively planarize the dielectric layers, which insulate the multi-level interconnects. Despite this advantage, the process still suffer from large global non-uniformity within a die and acro...
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| Format: | Thesis |
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2008
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| Online Access: | http://hdl.handle.net/10356/3766 |