Study on low temperature bonding solders for in-50 atomic % Sn/Cu joint for 3-D integrated circuit (IC)
In this project, the interaction between bi-layer eutectic In-Sn solder thin film and Cu for 3-D IC is studied. By using characterization methods such as scanning electron microscopy – energy dispersive x-ray spectroscopy (SEM-EDX) and shear test, the effects of bonding and annealing temperatures on...
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| Format: | Final Year Project (FYP) |
| Language: | English |
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2010
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| Online Access: | http://hdl.handle.net/10356/38687 |