Study on low temperature indium based solder for 3D integrated circuits application
Due to limitations of the conventional 2-dimensional integrated circuit (IC) layout, the electronics industry has shifted its research focus towards 3-dimensional (3D) ICs design to overcome such future problems. A common 3D ICs architecture that has been proposed involves the stacking of multiple c...
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| Format: | Final Year Project (FYP) |
| Language: | English |
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2010
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| Online Access: | http://hdl.handle.net/10356/38702 |