De-layering of copper and low-k dielectrics for semiconductor devices failure analysis
This project aims to quantify the rate of copper de-layered during Chemical Mechanical Polishing for semiconductor devices. This is to improve the effectiveness of de-layering copper during failure analysis since copper is prone to smearing, erosion and dishing. The report is generally divided into...
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| Format: | Final Year Project (FYP) |
| Language: | English |
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2010
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| Online Access: | http://hdl.handle.net/10356/38706 |