Three-dimensional (3D) finite element modeling of stress distribution and migration in Cu interconnects

56 p.

Bibliographic Details
Main Author:	Anson Heryanto
Other Authors:	Pey Kin Leong
Format:	Thesis
Published:	2010
Subjects:	DRNTU::Engineering::Electrical and electronic engineering
Online Access:	http://hdl.handle.net/10356/39142

Internet

http://hdl.handle.net/10356/39142