Novel via technology for high current densities
Through-wafer electrical connections are becoming increasingly important for Micro-Electro-Mechanical systems (MEMS). For a MEMS design structure containing electrical components within an enclosed cavity, through-wafer electrical connections would be an ideal solution to supply power to the electri...
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| Format: | Final Year Project (FYP) |
| Language: | English |
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2010
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| Online Access: | http://hdl.handle.net/10356/40603 |