Mixed mode loading test and analysis on bonded joints
Solder joints are a common sight in electronic packaging which serves as mechanical and electrical interconnects in a package. Solder joints are prone to failure during a drop and the fracture behaviour and failure modes can differ under various loading conditions. The failure modes can var...
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| Format: | Final Year Project (FYP) |
| Language: | English |
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2010
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| Online Access: | http://hdl.handle.net/10356/40852 |