Mixed mode loading test and analysis on bonded joints
Solder joints are a common sight in electronic packaging which serves as mechanical and electrical interconnects in a package. Solder joints are prone to failure during a drop and the fracture behaviour and failure modes can differ under various loading conditions. The failure modes can var...
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| Other Authors: | |
| Format: | Final Year Project (FYP) |
| Language: | English |
| Published: |
2010
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| Subjects: | |
| Online Access: | http://hdl.handle.net/10356/40852 |
| _version_ | 1811695128971051008 |
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| author | Lim, Dao Hao. |
| author2 | Pang Hock Lye, John |
| author_facet | Pang Hock Lye, John Lim, Dao Hao. |
| author_sort | Lim, Dao Hao. |
| collection | NTU |
| description | Solder joints are a common sight in electronic packaging which serves as mechanical and
electrical interconnects in a package. Solder joints are prone to failure during a drop and
the fracture behaviour and failure modes can differ under various loading conditions. The
failure modes can vary from brittle intermetallic layer fracture to ductile bulk solder shear
failure or a combination of both depending on the conditions.
In this project, the solder joint is subjected to different type of tests under varying
parameters and loading conditions to investigate the effect of mode mixity and plastic
constraint on the failure mechanism. A CMM specimen is used to measure the outcome
by putting it under a universal tester machine and changing the strain rate, type of tests
and creating a crack within the solder joint.
Yield strength and work hardening were observed to increase substantially as strain rate
increases. Brittle failure is also noticed to be associated with higher strain rates and pure
tensile test, and vice versa. Pure tensile test is noted to produce intermetallic failure while
pure shear and mixed-mode tests results in bulk solder failure.
Based on the results collected and computed, the fracture failure behaviour and mode of
the solder joint are then recorded and discussed so as to establish, and improve the
mechanical properties of the solder joint. |
| first_indexed | 2024-10-01T07:18:33Z |
| format | Final Year Project (FYP) |
| id | ntu-10356/40852 |
| institution | Nanyang Technological University |
| language | English |
| last_indexed | 2024-10-01T07:18:33Z |
| publishDate | 2010 |
| record_format | dspace |
| spelling | ntu-10356/408522023-03-04T18:18:33Z Mixed mode loading test and analysis on bonded joints Lim, Dao Hao. Pang Hock Lye, John School of Mechanical and Aerospace Engineering DRNTU::Engineering::Mechanical engineering Solder joints are a common sight in electronic packaging which serves as mechanical and electrical interconnects in a package. Solder joints are prone to failure during a drop and the fracture behaviour and failure modes can differ under various loading conditions. The failure modes can vary from brittle intermetallic layer fracture to ductile bulk solder shear failure or a combination of both depending on the conditions. In this project, the solder joint is subjected to different type of tests under varying parameters and loading conditions to investigate the effect of mode mixity and plastic constraint on the failure mechanism. A CMM specimen is used to measure the outcome by putting it under a universal tester machine and changing the strain rate, type of tests and creating a crack within the solder joint. Yield strength and work hardening were observed to increase substantially as strain rate increases. Brittle failure is also noticed to be associated with higher strain rates and pure tensile test, and vice versa. Pure tensile test is noted to produce intermetallic failure while pure shear and mixed-mode tests results in bulk solder failure. Based on the results collected and computed, the fracture failure behaviour and mode of the solder joint are then recorded and discussed so as to establish, and improve the mechanical properties of the solder joint. Bachelor of Engineering (Mechanical Engineering) 2010-06-23T01:03:15Z 2010-06-23T01:03:15Z 2010 2010 Final Year Project (FYP) http://hdl.handle.net/10356/40852 en Nanyang Technological University 80 p. application/pdf |
| spellingShingle | DRNTU::Engineering::Mechanical engineering Lim, Dao Hao. Mixed mode loading test and analysis on bonded joints |
| title | Mixed mode loading test and analysis on bonded joints |
| title_full | Mixed mode loading test and analysis on bonded joints |
| title_fullStr | Mixed mode loading test and analysis on bonded joints |
| title_full_unstemmed | Mixed mode loading test and analysis on bonded joints |
| title_short | Mixed mode loading test and analysis on bonded joints |
| title_sort | mixed mode loading test and analysis on bonded joints |
| topic | DRNTU::Engineering::Mechanical engineering |
| url | http://hdl.handle.net/10356/40852 |
| work_keys_str_mv | AT limdaohao mixedmodeloadingtestandanalysisonbondedjoints |