Carbon doped silicon oxides for low k dielectric applications in multilevel interconnects
This project aims at deposition and characterization of carbon doped silicon oxides (SiOCH) low k dieletrics for multilevel interconnect applications. The optical, electrical, mechanical, structural and thermal properties of SiOCH films have been studied.
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| Format: | Thesis |
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2008
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| Online Access: | https://hdl.handle.net/10356/4112 |