Pulsed laser annealing for the formation of ultra-shallow junctions for nano-scale metal-oxide-semiconductor technologies

The continuous scaling of gate dimensions has created a strong need for better ultrashallow junction technology to suppress short channel effect, which is more serious for shorter devices. As ion implantation remains the most popular method for dopant introduction, tremendous effort has been drawn i...

Full description

Bibliographic Details
Main Author: Ong, Kuang Kian
Other Authors: Lee Pooi See
Format: Thesis
Language:English
Published: 2010
Subjects:
Online Access:https://hdl.handle.net/10356/41418
_version_ 1811685710639398912
author Ong, Kuang Kian
author2 Lee Pooi See
author_facet Lee Pooi See
Ong, Kuang Kian
author_sort Ong, Kuang Kian
collection NTU
description The continuous scaling of gate dimensions has created a strong need for better ultrashallow junction technology to suppress short channel effect, which is more serious for shorter devices. As ion implantation remains the most popular method for dopant introduction, tremendous effort has been drawn into the development of post-implantation annealing techniques. Laser annealing (LA) has been shown to be a promising technique in the formation of ultra-shallow junction due to a number of its favorable features. LA has a near-zero thermal budget that is capable of producing a highly activated and abrupt ultra-shallow junction.
first_indexed 2024-10-01T04:48:51Z
format Thesis
id ntu-10356/41418
institution Nanyang Technological University
language English
last_indexed 2024-10-01T04:48:51Z
publishDate 2010
record_format dspace
spelling ntu-10356/414182023-07-04T17:34:52Z Pulsed laser annealing for the formation of ultra-shallow junctions for nano-scale metal-oxide-semiconductor technologies Ong, Kuang Kian Lee Pooi See Pey Kin Leong School of Electrical and Electronic Engineering DRNTU::Engineering::Electrical and electronic engineering::Semiconductors DRNTU::Engineering::Electrical and electronic engineering::Microelectronics The continuous scaling of gate dimensions has created a strong need for better ultrashallow junction technology to suppress short channel effect, which is more serious for shorter devices. As ion implantation remains the most popular method for dopant introduction, tremendous effort has been drawn into the development of post-implantation annealing techniques. Laser annealing (LA) has been shown to be a promising technique in the formation of ultra-shallow junction due to a number of its favorable features. LA has a near-zero thermal budget that is capable of producing a highly activated and abrupt ultra-shallow junction. DOCTOR OF PHILOSOPHY (EEE) 2010-07-02T08:03:08Z 2010-07-02T08:03:08Z 2008 2008 Thesis Ong, K. K. (2008). Pulsed laser annealing for the formation of ultra-shallow junctions for nano-scale metal-oxide-semiconductor technologies. Doctoral thesis, Nanyang Technological University, Singapore. https://hdl.handle.net/10356/41418 10.32657/10356/41418 en 214 p. application/pdf
spellingShingle DRNTU::Engineering::Electrical and electronic engineering::Semiconductors
DRNTU::Engineering::Electrical and electronic engineering::Microelectronics
Ong, Kuang Kian
Pulsed laser annealing for the formation of ultra-shallow junctions for nano-scale metal-oxide-semiconductor technologies
title Pulsed laser annealing for the formation of ultra-shallow junctions for nano-scale metal-oxide-semiconductor technologies
title_full Pulsed laser annealing for the formation of ultra-shallow junctions for nano-scale metal-oxide-semiconductor technologies
title_fullStr Pulsed laser annealing for the formation of ultra-shallow junctions for nano-scale metal-oxide-semiconductor technologies
title_full_unstemmed Pulsed laser annealing for the formation of ultra-shallow junctions for nano-scale metal-oxide-semiconductor technologies
title_short Pulsed laser annealing for the formation of ultra-shallow junctions for nano-scale metal-oxide-semiconductor technologies
title_sort pulsed laser annealing for the formation of ultra shallow junctions for nano scale metal oxide semiconductor technologies
topic DRNTU::Engineering::Electrical and electronic engineering::Semiconductors
DRNTU::Engineering::Electrical and electronic engineering::Microelectronics
url https://hdl.handle.net/10356/41418
work_keys_str_mv AT ongkuangkian pulsedlaserannealingfortheformationofultrashallowjunctionsfornanoscalemetaloxidesemiconductortechnologies