Micro-deformation characterization of electronic packaging materials and assemblies
The continuing miniaturization of microelectronic assemblies and devices requires experimental micro-deformation analysis technique for material characterization and structure reliability analysis. This work investigates both theoretical aspects and practical applications of digital image correlatio...
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| Format: | Thesis |
| Language: | English |
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2010
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| Online Access: | https://hdl.handle.net/10356/41563 |