Quality improvement for molding process
Molding process is a process of fixing the molding compound onto the substrate to make the IC body. From the analyses of the current quality practice in company, it was found that the main defects associated with the molding process were substrate crack, mold bleed and wire sweep. The main proble...
| Main Author: | |
|---|---|
| Other Authors: | |
| Format: | Thesis |
| Language: | English |
| Published: |
2010
|
| Subjects: | |
| Online Access: | http://hdl.handle.net/10356/41579 |