Quality improvement for molding process
Molding process is a process of fixing the molding compound onto the substrate to make the IC body. From the analyses of the current quality practice in company, it was found that the main defects associated with the molding process were substrate crack, mold bleed and wire sweep. The main proble...
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| Other Authors: | |
| Format: | Thesis |
| Language: | English |
| Published: |
2010
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| Online Access: | http://hdl.handle.net/10356/41579 |
| _version_ | 1811681461009383424 |
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| author | Yang, Chang Cheng |
| author2 | Lam Yee Cheong |
| author_facet | Lam Yee Cheong Yang, Chang Cheng |
| author_sort | Yang, Chang Cheng |
| collection | NTU |
| description | Molding process is a process of fixing the molding compound onto the substrate to make the IC body.
From the analyses of the current quality practice in company, it was found that the main defects associated with the molding process were substrate crack, mold bleed and wire sweep. The main problems which caused these defects were solder mask cannot withstand molding machine pressure; substrate thickness variation caused mold bleed in one direction; and susbstrate warpage caused wire sweep. |
| first_indexed | 2024-10-01T03:41:18Z |
| format | Thesis |
| id | ntu-10356/41579 |
| institution | Nanyang Technological University |
| language | English |
| last_indexed | 2024-10-01T03:41:18Z |
| publishDate | 2010 |
| record_format | dspace |
| spelling | ntu-10356/415792023-03-11T17:02:11Z Quality improvement for molding process Yang, Chang Cheng Lam Yee Cheong School of Mechanical and Aerospace Engineering DRNTU::Engineering::Manufacturing::Quality control Molding process is a process of fixing the molding compound onto the substrate to make the IC body. From the analyses of the current quality practice in company, it was found that the main defects associated with the molding process were substrate crack, mold bleed and wire sweep. The main problems which caused these defects were solder mask cannot withstand molding machine pressure; substrate thickness variation caused mold bleed in one direction; and susbstrate warpage caused wire sweep. Master of Science (Mechanics & Processing of Materials) 2010-07-21T08:42:03Z 2010-07-21T08:42:03Z 2008 2008 Thesis http://hdl.handle.net/10356/41579 en 75 p. application/pdf |
| spellingShingle | DRNTU::Engineering::Manufacturing::Quality control Yang, Chang Cheng Quality improvement for molding process |
| title | Quality improvement for molding process |
| title_full | Quality improvement for molding process |
| title_fullStr | Quality improvement for molding process |
| title_full_unstemmed | Quality improvement for molding process |
| title_short | Quality improvement for molding process |
| title_sort | quality improvement for molding process |
| topic | DRNTU::Engineering::Manufacturing::Quality control |
| url | http://hdl.handle.net/10356/41579 |
| work_keys_str_mv | AT yangchangcheng qualityimprovementformoldingprocess |