Solid state diffusion bonding of superalloy X-750 in air ambience

Conventional diffusion bonding processes require a vacuum ambience. This results in high production cost and other disadvantages and limits its application. Therefore, alternative bonding methods have been sought by researchers for a long time. In this study, a novel form of diffusion bonding was pr...

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Bibliographic Details
Main Author: Dong, Guo Ming
Other Authors: Roop Singh Chandel
Format: Thesis
Language:English
Published: 2011
Subjects:
Online Access:http://hdl.handle.net/10356/42605