Electrical characterization of IC packages
In this project, a PBGA package 3D lumped element model is developed and its parasitics are extracted using a FEM based solver. The package data is validated with a standard measurement procedure developed by JEDEC. This simulation methodology can be extended to other critical signals and packages,...
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| Format: | Thesis |
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2008
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| Online Access: | http://hdl.handle.net/10356/4325 |