Electrical characterization of IC packages
In this project, a PBGA package 3D lumped element model is developed and its parasitics are extracted using a FEM based solver. The package data is validated with a standard measurement procedure developed by JEDEC. This simulation methodology can be extended to other critical signals and packages,...
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| Formato: | Thesis |
| Publicado em: |
2008
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| Acesso em linha: | http://hdl.handle.net/10356/4325 |
| _version_ | 1826116543626346496 |
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| author | Guruprasad B. G. |
| author2 | Liu, Ai Qun |
| author_facet | Liu, Ai Qun Guruprasad B. G. |
| author_sort | Guruprasad B. G. |
| collection | NTU |
| description | In this project, a PBGA package 3D lumped element model is developed and its parasitics are extracted using a FEM based solver. The package data is validated with a standard measurement procedure developed by JEDEC. This simulation methodology can be extended to other critical signals and packages, and the parasitics can be extracted. |
| first_indexed | 2024-10-01T04:13:26Z |
| format | Thesis |
| id | ntu-10356/4325 |
| institution | Nanyang Technological University |
| last_indexed | 2024-10-01T04:13:26Z |
| publishDate | 2008 |
| record_format | dspace |
| spelling | ntu-10356/43252023-07-04T15:43:12Z Electrical characterization of IC packages Guruprasad B. G. Liu, Ai Qun School of Electrical and Electronic Engineering DRNTU::Engineering::Electrical and electronic engineering::Electronic packaging In this project, a PBGA package 3D lumped element model is developed and its parasitics are extracted using a FEM based solver. The package data is validated with a standard measurement procedure developed by JEDEC. This simulation methodology can be extended to other critical signals and packages, and the parasitics can be extracted. Master of Science (Microelectronics) 2008-09-17T09:49:18Z 2008-09-17T09:49:18Z 2003 2003 Thesis http://hdl.handle.net/10356/4325 Nanyang Technological University application/pdf |
| spellingShingle | DRNTU::Engineering::Electrical and electronic engineering::Electronic packaging Guruprasad B. G. Electrical characterization of IC packages |
| title | Electrical characterization of IC packages |
| title_full | Electrical characterization of IC packages |
| title_fullStr | Electrical characterization of IC packages |
| title_full_unstemmed | Electrical characterization of IC packages |
| title_short | Electrical characterization of IC packages |
| title_sort | electrical characterization of ic packages |
| topic | DRNTU::Engineering::Electrical and electronic engineering::Electronic packaging |
| url | http://hdl.handle.net/10356/4325 |
| work_keys_str_mv | AT guruprasadbg electricalcharacterizationoficpackages |