Electromigration study of through silicon via (TSV)
In the continuous drive for smaller chips (Moore’s Law) and heterogeneous semiconductor applications, traditional processing and packaging technologies may not be able to support this trend. 3-D IC can offer a greater packing density in the same footprint as 2-D miniaturizing is reaching its physic...
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| Format: | Thesis |
| Language: | English |
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2011
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| Online Access: | https://hdl.handle.net/10356/43544 |