Residual stress in thin film
The objective of this report is to observe the trend of residual stress with respect to (i) Substrate Bias applied during pre-deposition substrate treatment and (ii) film thickness of (Ti,Al)(N,C) coating material on High-Speed Steel (HSS) substrate. The parameters varied from (i) 0-300W and (ii) 0....
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| Format: | Final Year Project (FYP) |
| Language: | English |
| Published: |
2011
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| Online Access: | http://hdl.handle.net/10356/44486 |
| _version_ | 1811684871295205376 |
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| author | Hoon, Esther Li Wen. |
| author2 | School of Materials Science and Engineering |
| author_facet | School of Materials Science and Engineering Hoon, Esther Li Wen. |
| author_sort | Hoon, Esther Li Wen. |
| collection | NTU |
| description | The objective of this report is to observe the trend of residual stress with respect to (i) Substrate Bias applied during pre-deposition substrate treatment and (ii) film thickness of (Ti,Al)(N,C) coating material on High-Speed Steel (HSS) substrate. The parameters varied from (i) 0-300W and (ii) 0.856-2.76 µm. Trend in residual stress was observed to decrease when the substrate is subjected to bias up to 200W after which the stress increases with increasing bias up to 300W. The initial drop in residual stress is speculated to be due to the decrease amount of impurities at the interface of the film and the substrate whereas the subsequent increase in the stress might be due to surface stress effect and/or more voids present in the film as a result of higher surface roughness of the substrate. Residual stress was observed to increase with increasing thickness of up to 2.68 µm after which a decrease was observed with increasing thickness of up to 2.78 µm. The trend observed is speculated to be due to surface stress effect and crystallite coalescence. Future research is recommended to investigate on the relationship of grain growth with respect to the varying parameters and its effects on residual stress to further support the discussion of this report. |
| first_indexed | 2024-10-01T04:35:31Z |
| format | Final Year Project (FYP) |
| id | ntu-10356/44486 |
| institution | Nanyang Technological University |
| language | English |
| last_indexed | 2024-10-01T04:35:31Z |
| publishDate | 2011 |
| record_format | dspace |
| spelling | ntu-10356/444862023-03-04T15:42:37Z Residual stress in thin film Hoon, Esther Li Wen. School of Materials Science and Engineering Huang Yi Zhong DRNTU::Engineering::Materials::Ceramic materials The objective of this report is to observe the trend of residual stress with respect to (i) Substrate Bias applied during pre-deposition substrate treatment and (ii) film thickness of (Ti,Al)(N,C) coating material on High-Speed Steel (HSS) substrate. The parameters varied from (i) 0-300W and (ii) 0.856-2.76 µm. Trend in residual stress was observed to decrease when the substrate is subjected to bias up to 200W after which the stress increases with increasing bias up to 300W. The initial drop in residual stress is speculated to be due to the decrease amount of impurities at the interface of the film and the substrate whereas the subsequent increase in the stress might be due to surface stress effect and/or more voids present in the film as a result of higher surface roughness of the substrate. Residual stress was observed to increase with increasing thickness of up to 2.68 µm after which a decrease was observed with increasing thickness of up to 2.78 µm. The trend observed is speculated to be due to surface stress effect and crystallite coalescence. Future research is recommended to investigate on the relationship of grain growth with respect to the varying parameters and its effects on residual stress to further support the discussion of this report. Bachelor of Engineering (Materials Engineering) 2011-06-02T01:36:16Z 2011-06-02T01:36:16Z 2011 2011 Final Year Project (FYP) http://hdl.handle.net/10356/44486 en Nanyang Technological University 44 p. application/pdf |
| spellingShingle | DRNTU::Engineering::Materials::Ceramic materials Hoon, Esther Li Wen. Residual stress in thin film |
| title | Residual stress in thin film |
| title_full | Residual stress in thin film |
| title_fullStr | Residual stress in thin film |
| title_full_unstemmed | Residual stress in thin film |
| title_short | Residual stress in thin film |
| title_sort | residual stress in thin film |
| topic | DRNTU::Engineering::Materials::Ceramic materials |
| url | http://hdl.handle.net/10356/44486 |
| work_keys_str_mv | AT hoonestherliwen residualstressinthinfilm |