Physical and electrical failure analysis of Cu/low k interconnect system
Time-dependent dielectric breakdown (TDDB) is becoming one of the main reliability issues of Cu/low-k interconnect. In the study of TDDB breakdown mechanisms, a non-conventional single terminated tip test structure that provides easier failure site identification has been used. A new single terminat...
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| Format: | Final Year Project (FYP) |
| Language: | English |
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2011
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| Online Access: | http://hdl.handle.net/10356/44535 |