Grinding of silicon wafer for molding applications
This project deals with grinding the sides of a silicon wafer chip to a 10° angle, whilst achieving a good surface roughness and low subsurface damage. The experiment was conducted on a conventional sanding machine, where there is a fixture fixed in the z axis to the platform. The fixture has x...
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| Format: | Final Year Project (FYP) |
| Language: | English |
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2011
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| Online Access: | http://hdl.handle.net/10356/45995 |