Thermal stress analysis and characterization of thermo-mechanical properties of thin films on an elastic substrate

Stress and thermomechanical behavior of thin films deposited atop a substrate upon thermal loading/unloading have been investigated extensively in the past decades, which was partially stimulated by the development of micro- and nanotechnology. However, most of the previous effort in analysis was fo...

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Bibliographic Details
Main Author: Hu, YingYong
Other Authors: Huang Weimin
Format: Thesis
Language:English
Published: 2011
Subjects:
Online Access:https://hdl.handle.net/10356/46439