Single and two phase heat transfer in novel porous foams
The rapid development of technology in the last decades brings increased challenges in the cooling of electronic devices. Densely packed electronic systems require more effective methods to dissipate the heat generated by the chips and circuits. Porous media with high effective thermal conductivity...
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| 格式: | Thesis |
| 語言: | English |
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2011
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| 在線閱讀: | https://hdl.handle.net/10356/46544 |