Interface characterization of wafer bonding

189 p.

Bibliographic Details
Main Author:	Sun, Lina
Other Authors:	Tan Cher Ming
Format:	Thesis
Published:	2011
Subjects:	DRNTU::Engineering::Electrical and electronic engineering
Online Access:	https://hdl.handle.net/10356/46809

Internet

https://hdl.handle.net/10356/46809