High frequency measurement of dielectric properties for packaging materials
This thesis summarizes the purpose and milestones covered in the process of carrying out the project. Essentially, the project proposes to develop and implement a suitable method to measure the complex permittivity of thin (l-3mm) packaging materials used in the microelectronics industry. Apart from...
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| 格式: | Thesis |
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2008
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| 在線閱讀: | https://hdl.handle.net/10356/4699 |