High frequency measurement of dielectric properties for packaging materials
This thesis summarizes the purpose and milestones covered in the process of carrying out the project. Essentially, the project proposes to develop and implement a suitable method to measure the complex permittivity of thin (l-3mm) packaging materials used in the microelectronics industry. Apart from...
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| Format: | Thesis |
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2008
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| Online Access: | https://hdl.handle.net/10356/4699 |
| _version_ | 1826121389328826368 |
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| author | Lim, Ying Ying |
| author2 | Mihai Dragos Rotaru |
| author_facet | Mihai Dragos Rotaru Lim, Ying Ying |
| author_sort | Lim, Ying Ying |
| collection | NTU |
| description | This thesis summarizes the purpose and milestones covered in the process of carrying out the project. Essentially, the project proposes to develop and implement a suitable method to measure the complex permittivity of thin (l-3mm) packaging materials used in the microelectronics industry. Apart from being able to measure over a large bandwidth from 0.1 -20 GHz and be relatively low cost and easy to implement, the technique also has to be reasonably accurate as compared to other available methods. |
| first_indexed | 2024-10-01T05:31:51Z |
| format | Thesis |
| id | ntu-10356/4699 |
| institution | Nanyang Technological University |
| last_indexed | 2024-10-01T05:31:51Z |
| publishDate | 2008 |
| record_format | dspace |
| spelling | ntu-10356/46992023-07-04T16:56:36Z High frequency measurement of dielectric properties for packaging materials Lim, Ying Ying Mihai Dragos Rotaru Arokiaswami Alphones School of Electrical and Electronic Engineering DRNTU::Engineering::Electrical and electronic engineering::Electronic packaging This thesis summarizes the purpose and milestones covered in the process of carrying out the project. Essentially, the project proposes to develop and implement a suitable method to measure the complex permittivity of thin (l-3mm) packaging materials used in the microelectronics industry. Apart from being able to measure over a large bandwidth from 0.1 -20 GHz and be relatively low cost and easy to implement, the technique also has to be reasonably accurate as compared to other available methods. MASTER OF ENGINEERING (EEE) 2008-09-17T09:56:54Z 2008-09-17T09:56:54Z 2005 2005 Thesis Lim, Y. Y. (2005). High frequency measurement of dielectric properties for packaging materials. Master’s thesis, Nanyang Technological University, Singapore. https://hdl.handle.net/10356/4699 10.32657/10356/4699 Nanyang Technological University application/pdf |
| spellingShingle | DRNTU::Engineering::Electrical and electronic engineering::Electronic packaging Lim, Ying Ying High frequency measurement of dielectric properties for packaging materials |
| title | High frequency measurement of dielectric properties for packaging materials |
| title_full | High frequency measurement of dielectric properties for packaging materials |
| title_fullStr | High frequency measurement of dielectric properties for packaging materials |
| title_full_unstemmed | High frequency measurement of dielectric properties for packaging materials |
| title_short | High frequency measurement of dielectric properties for packaging materials |
| title_sort | high frequency measurement of dielectric properties for packaging materials |
| topic | DRNTU::Engineering::Electrical and electronic engineering::Electronic packaging |
| url | https://hdl.handle.net/10356/4699 |
| work_keys_str_mv | AT limyingying highfrequencymeasurementofdielectricpropertiesforpackagingmaterials |