Stress calculation and failure prevention for microelectronics devices
This project presents a numerical investigation on the thermo-mechanical reliability of microelectronics devices. Thermo-mechanical reliability is one of the major bottlenecks for both current and future microelectronics devices. The current finial year project is to study the Stress Calculation and...
| Main Author: | |
|---|---|
| Other Authors: | |
| Format: | Final Year Project (FYP) |
| Language: | English |
| Published: |
2012
|
| Subjects: | |
| Online Access: | http://hdl.handle.net/10356/47711 |