Study of copper diffusion in tantalum based barrier materials

This thesis presents our findings on Cu diffusion into different potential barrier layers.

Bibliographic Details
Main Author: Loh, Seow Wee.
Other Authors: Zhang, Dao Hua
Format: Thesis
Published: 2008
Subjects:
Online Access:http://hdl.handle.net/10356/4794
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author Loh, Seow Wee.
author2 Zhang, Dao Hua
author_facet Zhang, Dao Hua
Loh, Seow Wee.
author_sort Loh, Seow Wee.
collection NTU
description This thesis presents our findings on Cu diffusion into different potential barrier layers.
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institution Nanyang Technological University
last_indexed 2024-10-01T07:10:23Z
publishDate 2008
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spelling ntu-10356/47942023-07-04T16:02:12Z Study of copper diffusion in tantalum based barrier materials Loh, Seow Wee. Zhang, Dao Hua School of Electrical and Electronic Engineering DRNTU::Engineering::Electrical and electronic engineering::Electric apparatus and materials This thesis presents our findings on Cu diffusion into different potential barrier layers. Doctor of Philosophy (EEE) 2008-09-17T09:58:49Z 2008-09-17T09:58:49Z 2004 2004 Thesis http://hdl.handle.net/10356/4794 Nanyang Technological University application/pdf
spellingShingle DRNTU::Engineering::Electrical and electronic engineering::Electric apparatus and materials
Loh, Seow Wee.
Study of copper diffusion in tantalum based barrier materials
title Study of copper diffusion in tantalum based barrier materials
title_full Study of copper diffusion in tantalum based barrier materials
title_fullStr Study of copper diffusion in tantalum based barrier materials
title_full_unstemmed Study of copper diffusion in tantalum based barrier materials
title_short Study of copper diffusion in tantalum based barrier materials
title_sort study of copper diffusion in tantalum based barrier materials
topic DRNTU::Engineering::Electrical and electronic engineering::Electric apparatus and materials
url http://hdl.handle.net/10356/4794
work_keys_str_mv AT lohseowwee studyofcopperdiffusionintantalumbasedbarriermaterials