Low temperature thermocompression bonding of copper-copper bumps using gold alloy nanoparticles

Low temperature thermocompression bonding of copper-copper bumps using gold alloy nanoparticles

One of the key methods to form interconnects between electrical packages and devices is by thermocompression bonding. The reliability of these metallic interconnects are often dictated by bonding parameters like temperature, time and pressure. Copper (Cu) which possesses outstanding mechanical, elec...

Full description

Bibliographic Details
Main Author: Tan, Shi Liang.
Other Authors: Wong Chee Cheong
Format: Final Year Project (FYP)
Language:English
Published: 2012
Subjects:
DRNTU::Engineering::Materials::Electronic packaging materials
DRNTU::Engineering::Materials::Microelectronics and semiconductor materials::Nanoelectronics and interconnects
Online Access:http://hdl.handle.net/10356/48405

Internet

http://hdl.handle.net/10356/48405

Similar Items