Hermetic sealing of MEMS sensors for high temperature electronics applications
In this study, 100 μm sealing width of both Al-Ge eutectic bonds and Pt-In Transient Liquid Phase bonds were fabricated and evaluated. The experiments were conducted to determine the feasibility of the bonding for usage in high temperature applications. The samples underwent shear tes...
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| 格式: | Final Year Project (FYP) |
| 语言: | English |
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2012
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| 在线阅读: | http://hdl.handle.net/10356/48873 |