Thermal performance study of a liquid-cooled porous thermosyphon system
With the ever rapid advances in silicon chip technology, heat fluxes from high speed electronic devices are increasing at an alarming rate and have now, reached levels where single phase cooling such as air cooled can adequately remove the heat. The use of two-phase cooling in thermosyphons has prov...
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| Format: | Final Year Project (FYP) |
| Language: | English |
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2012
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| Online Access: | http://hdl.handle.net/10356/49741 |