Thin film characterizations for resistive memory

Resistive memory is currently one of the focused research topics in semiconductor and microelectronics research activities. Resistive memory has advantages of high density, 3-D architecture design, easy to fabrication, low-power use, non-volatile, and high expected performance. In this Final Year Pr...

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Bibliographic Details
Main Author: Weng, Bao Bin.
Other Authors: Zhu Weiguang
Format: Final Year Project (FYP)
Language:English
Published: 2012
Subjects:
Online Access:http://hdl.handle.net/10356/49815
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author Weng, Bao Bin.
author2 Zhu Weiguang
author_facet Zhu Weiguang
Weng, Bao Bin.
author_sort Weng, Bao Bin.
collection NTU
description Resistive memory is currently one of the focused research topics in semiconductor and microelectronics research activities. Resistive memory has advantages of high density, 3-D architecture design, easy to fabrication, low-power use, non-volatile, and high expected performance. In this Final Year Project, very thin films with thickness in a range of 1 – 10 nm thick will be grown using the state-of-the-arts laser molecular beam epitaxy (laser-MBE) technology by research staff and graduate students, afterwhich characterize conduction/resistive behavior and other physical and electrical properties of such nano-thin films. The student will closely work with supervisor, research staff and graduate student.
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spelling ntu-10356/498152023-07-07T17:10:52Z Thin film characterizations for resistive memory Weng, Bao Bin. Zhu Weiguang School of Electrical and Electronic Engineering DRNTU::Engineering::Electrical and electronic engineering::Semiconductors DRNTU::Engineering::Electrical and electronic engineering::Microelectronics Resistive memory is currently one of the focused research topics in semiconductor and microelectronics research activities. Resistive memory has advantages of high density, 3-D architecture design, easy to fabrication, low-power use, non-volatile, and high expected performance. In this Final Year Project, very thin films with thickness in a range of 1 – 10 nm thick will be grown using the state-of-the-arts laser molecular beam epitaxy (laser-MBE) technology by research staff and graduate students, afterwhich characterize conduction/resistive behavior and other physical and electrical properties of such nano-thin films. The student will closely work with supervisor, research staff and graduate student. Bachelor of Engineering 2012-05-24T08:19:20Z 2012-05-24T08:19:20Z 2012 2012 Final Year Project (FYP) http://hdl.handle.net/10356/49815 en Nanyang Technological University 48 p. application/pdf
spellingShingle DRNTU::Engineering::Electrical and electronic engineering::Semiconductors
DRNTU::Engineering::Electrical and electronic engineering::Microelectronics
Weng, Bao Bin.
Thin film characterizations for resistive memory
title Thin film characterizations for resistive memory
title_full Thin film characterizations for resistive memory
title_fullStr Thin film characterizations for resistive memory
title_full_unstemmed Thin film characterizations for resistive memory
title_short Thin film characterizations for resistive memory
title_sort thin film characterizations for resistive memory
topic DRNTU::Engineering::Electrical and electronic engineering::Semiconductors
DRNTU::Engineering::Electrical and electronic engineering::Microelectronics
url http://hdl.handle.net/10356/49815
work_keys_str_mv AT wengbaobin thinfilmcharacterizationsforresistivememory